http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140031273-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0752 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D161-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04 |
| filingDate | 2012-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c68d49c6564caaeac8b4644bb7dab3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f853984c85e67773ba6e4556eadbb0f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c0452e284a5a86237da1921f4359799 |
| publicationDate | 2014-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20140031273-A |
| titleOfInvention | Phenolic Resin and Underlayer Film-forming Material for Lithography |
| abstract | A novel phenolic resin which can be used as a coating agent for semiconductors or as a resin for resists, has a high carbon concentration, low oxygen concentration, relatively high heat resistance, and relatively high solvent solubility, and is applicable to a wet process. In addition, the solvent solubility is relatively high, so that a wet process can be applied, and a material useful for forming a novel photoresist underlayer film having excellent etching performance as an underlayer film for multilayer resists, an underlayer film formed using the same, and a pattern forming method using the same. To provide. The resin of the present invention is obtained by reacting a compound having a specific structure and an aldehyde having a specific structure in the presence of an acidic catalyst. Moreover, the underlayer film forming material for lithography of this invention contains this resin and an organic solvent at least. |
| priorityDate | 2011-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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