| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_517a04cc4bffc3d216b19f45c9bde10d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 |
| filingDate |
2012-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7fcee67ae80e4af6cde620b252d22ef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38b2d07b9200d7710b5422dbde527f76
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5c51fbe0a2defaf59b919c5b20b2a3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_614ee9b959f227a605938a993e5bcc61 |
| publicationDate |
2014-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140028962-A |
| titleOfInvention |
Thick film peeling liquid composition for negative photoresist |
| abstract |
The present invention relates to a stripper composition for removing photoresist, wherein the composition according to the present invention comprises 1 to 5% by weight of the compound represented by the formula (1), 70 to 95% by weight of a polar organic solvent, and 0.1 to 5% by weight. It is characterized by containing a hydroxide compound of% and the remaining amount of water. The stripper composition according to the present invention can effectively complete the stripping process in a short time by including a proper amount of the compound represented by the formula (1) without including a corrosion inhibitor in the stripper composition, and has a relatively higher process temperature than other processes. It is possible to minimize the change in composition in the peeling process performed in the. In addition, by not including a corrosion inhibitor, it is possible to prevent electrode damage while preventing post-processing defects such as poor deposition due to adsorption of a water-insoluble corrosion inhibitor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170088048-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220124916-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105368611-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105368611-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160017606-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160074946-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180101183-A |
| priorityDate |
2012-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |