| abstract |
Suitable terminal structures include an insulating coating layer having a substrate, an electrode formed on the substrate, an opening formed on and on the substrate, the opening exposing at least a portion of the electrode, and in an area within the opening on the electrode, the upper surface being at the periphery of the opening. An under bump metal layer containing Ni and a domed bump containing Sn and Ti formed in a region within the opening on the under bump metal layer, the under bump metal layer and bumps The edge of the boundary of the boundary and the inner wall of the opening portion in the insulating coating layer are in contact with each other. |