http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140024822-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133723 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 2013-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fdcc1e651c62e5856b1347e39dc8f16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4b82f3811cc59f804f728979e50b55c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a57b0cc94cb5b78fd17a1d3154c5bf6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4bc52415cb71261a284e32dad04bfe90 |
| publicationDate | 2014-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20140024822-A |
| titleOfInvention | Production method of polyimide resin, production method of polyimide film, production method of polyamic acid solution, polyimide film and polyamic acid solution |
| abstract | (Problem) Providing a method for producing a polyimide resin, which is excellent in heat resistance and mechanical properties even by a low temperature heat treatment, and can obtain a polyimide resin having a low dielectric constant. Provided is a method for producing a polyimide film which is excellent in heat resistance and mechanical properties even by heat treatment at a low temperature and can obtain a polyimide film having a low dielectric constant. It is providing the manufacturing method of the polyamic-acid solution which provides the polyimide resin which is excellent in heat resistance and a mechanical characteristic also by low temperature heat processing, and has a low dielectric constant. Moreover, providing the polyimide membrane and polyamic-acid solution obtained by these methods. (Solution means) A polyamic acid obtained by reacting a tetracarboxylic dianhydride component and a diamine component in N, N, N ', N'-tetramethylurea is heated at a specific temperature to produce a polyimide resin. |
| priorityDate | 2012-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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