| abstract |
The present invention relates to a surface treatment agent capable of forming a coating film on the surface of copper or copper plating and a surface treatment method. The surface treatment agent according to one embodiment of the present invention is a surface treatment agent for copper or copper plating, which comprises 0.1 to 5 parts by weight of a benzimidazole-based compound of the following formula 1, 0.5 to 20 parts by weight of an organic acid, 0.8 to 1 part by weight, and 0.5 to 3 parts by weight of a color fading agent, and having a pH of 2 to 3. [Chemical Formula 1] Wherein R 1 is any one selected from an alkyl group and an aryl group having 1 to 15 carbon atoms, and R 2 and R 3 are each selected from H, one or more carbon alkyl groups, and halogen. |