http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140018989-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bb4ee28d43b5e8d4a3c5141fa9bcfeb0 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 |
| filingDate | 2008-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c9d8c6f1719e30cc979440747cea9e2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_836ad812dfda2df965e731cc3e817ed0 |
| publicationDate | 2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20140018989-A |
| titleOfInvention | Residue removal liquid after semiconductor drying process and residue removal method using the same |
| abstract | The present invention provides a residue removal liquid after a dry process comprising a surface protecting agent capable of preventing cracking and roughness of the Cu surface and preventing oxidation of the Cu surface, which could not be solved with a conventional polymer stripping liquid, and using the semiconductor using the same. Provided is a method of manufacturing a device. As a removal liquid of the residue which exists in a semiconductor substrate after dry etching and / or ashing, (1) Hetero five-membered aromatic compound which has a structure represented by Formula: = N-NH- (except that three N is continuous) is removed. It is a compound included as a basic skeleton, pH of this aqueous solution (10ppm, 23 degreeC) is 7 or less, and (2) Formula: -N = C (SH) -X- (wherein X is NH, O, or S It is a compound containing the hetero 5-membered ring compound which has a structure represented by the following formula as a basic skeleton, pH of this aqueous solution (10ppm, 23 degreeC) is 7 or less, and (3) At least 1 nitrogen atom (N) The branched compound is a compound containing a hetero 6-membered ring aromatic compound as a basic skeleton, and the Cu surface protective agent composed of at least one compound selected from the group consisting of pH 7 of the aqueous solution (10 ppm, 23 ° C.) and Cu (copper) Compounds that can form complexes or chelates with And comprises water and, pH is 4 to 9 relate to a residue remover. |
| priorityDate | 2007-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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