| abstract |
Repair methods for damaged low k films are provided. Damage to low k films occurs during processing of the film, for example, during etching, ashing and planarization. The processing of the low k film causes water to be stored in the pores of the film, and additionally, hydrophilic compounds are formed in the low k film structure. Repair processes, including ultraviolet (UV) radiation and carbon-containing compounds, remove water from the pores and further remove hydrophilic compounds from the low k film structure. |