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filingDate 2011-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a82bc8c1a7a9844a9c91d7628d506ab
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publicationDate 2014-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20140012705-A
titleOfInvention B-stageable skip-curable wafer backside coating adhesive
abstract The present invention is an adhesive composition comprising an elastomer, an epoxy resin, a reactive diluent and a filler. The compositions are suitable for use in the electronics industry and especially for wafer backside coating adhesives. The elastomer is a mixture of a vinyl elastomer (elastomer having carbon to carbon unsaturation) and an epoxy elastomer, and is present in an amount within the range of 20 to 40 wt%, preferably about 30 wt%, of the adhesive composition. The epoxy resin is present in the adhesive composition in the range of 3 wt% to 10 wt%, preferably about 5 wt%. A reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation to react with the acrylate elastomer and provide crosslinking in the composition after curing. One or both should be able to act as a solvent or diluent for the elastomer and be present in the adhesive composition in the range of from 35% to 50% by weight of the composition. The filler is a nonconductive filler and constitutes the remainder of the composition to a total amount of 100% by weight.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021206306-A1
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