| abstract |
There is provided a liquid removal composition and method for removing the material from a substrate having a sacrificial antireflective coating (SARC) material thereon. The liquid removal composition comprises at least one fluoride containing compound, at least one organic solvent, optionally water and optionally at least one chelating agent. The composition is capable of at least partially removing SARC material in the manufacture of integrated circuits while minimally etching metal species on the substrate, such as aluminum, copper and cobalt alloys, and without damaging the low k dielectric material used in semiconductor structures. . |