| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_951ade9cb9f29eb8a29ddae1e2fc87e3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1702
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75745
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-7598
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75983
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-75744
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B06B1-0292
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61B8-4411 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-607 |
| filingDate |
2012-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c42ed24288e72a55d08b9ddfa279848b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae0547a954ed97c72cd7e3f99db76425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_63f19b99aa4056459c339046c39d8c40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6d4b70e1f574c2184e8c91a4e88332f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6d1384334d3151b7d9b7cdc0ca2233e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49a44ec4f1365b683adaa2a94f92dd5b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_822fa74ca6481c656cb763a5e53814b1 |
| publicationDate |
2014-01-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140003720-A |
| titleOfInvention |
Jig, manufacturing method thereof and flip chip bonding method of chip for ultrasonic probe using jig |
| abstract |
wafer; An accommodating groove formed by etching the wafer and accommodating a capacitive microfabricated ultrasonic transducer (cMUT) during flip chip bonding; And a spaced groove formed by etching a portion of the bottom surface of the accommodation groove, and the cMUT is inserted into the accommodation groove so that the thin film of the cMUT faces the bottom surface of the spaced groove during flip chip bonding, and is not etched when the spaced groove is formed. The thin film of the cMUT is seated on the bottom surface of the receiving groove and spaced apart from the bottom surface of the spacer groove, thereby preventing damage to the semiconductor chip having a double-sided design structure that may occur during flip chip bonding. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9643212-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190080038-A |
| priorityDate |
2012-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |