| abstract |
An aluminum alloy molded package material having good moldability is provided. It contains Fe: 0.8 ~ 1.7mass%, Si: 0.05 ~ 0.20mass%, Cu: 0.0025 ~ 0.0200mass%, and the balance is composed of Al and unavoidable impurities, the average grain size is 20μm or less, Provided is a molded package material 1 having an aluminum alloy foil 8 having an average value YS of 0.2% yield strength and an average value TS of maximum tensile strength at 0 degrees, 45 degrees and 90 degrees, satisfying YS / TS ≦ 0.60. . |