| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1476752f2420c8f8eb53464cf7fc922b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10477
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-141
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate |
2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db2638e4823d688d5c44536208abfdb8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d3e94486a891dfc328a9d0a0ade42a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3145e7fbf4c045d221d28a5a2010a864
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9a90cfcf3b393b3036a74e2f69bff176
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_646f756cbfcef3b1f47a33900a1b7dba |
| publicationDate |
2014-01-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20140000151-A |
| titleOfInvention |
Electronic component module and its manufacturing method |
| abstract |
[PROBLEMS] An electronic component module in which a conductive land on a wiring board and a connection terminal member on a column are bonded to each other via a bonding portion and a resin layer for sealing the connection terminal member is formed on the wiring board. Thereby suppressing the outflow of the bonding material constituting the bonding portion in the reflow process to be performed. [Measures] At the junction 10 of the conductive land 7 and the connection terminal member 6, at least Cu-Sn-based, M-Sn-based (M is Ni and / or Mn), and Cu-M-Sn-based. The intermetallic compound generating region 25 in which the intermetallic compound is generated is present on the connection terminal member 6 side. The intermetallic compound generating region 25 is configured for the total number of masses except for the mass in which only a Sn-based metal component is present in one mass when the cross section is subdivided equally into 10 masses vertically and horizontally. The ratio of the number of masses in which at least two types of intermetallic compounds from which an element differs exists is 70% or more. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210107171-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190059972-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11688555-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170068422-A |
| priorityDate |
2012-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |