abstract |
Provided is a method for producing a Sn alloy bump with easy composition control of the Sn alloy bump. A method for producing a Sn alloy bump formed of an alloy of one kind or two or more kinds of metals different from Sn, wherein the Sn layer 4a is formed on the electrode pad 3 in the resist opening 2a formed on the substrate 1. The step of forming by electroplating, the step of laminating an alloy layer 4b of Sn and another metal by electroplating on the Sn layer 4a, and removing the resist 2 and then laminating with the Sn layer 4a It has a process of melting the alloy layer 4b and forming Sn alloy bump 5. |