| abstract |
This invention provides the compound which is excellent in heat resistance and compatibility with resin, and can fully improve the heat resistance of resin, and provides the compound specifically represented by following General formula (1). Formula (1) of, R 1 ~R 4 represents a C1~12 alkyl or C6~12 aryl, y is the number of 1~2000, X 1 represents a group represented by the formula (2) or (3) . In formula (2), R < 5> represents a hydrogen atom, O, a C1-12 alkyl group, or a C1-12 alkoxy group, and L < 1> represents a C1-6 alkylene group or C6-12 arylene group. Equation (3) of, R 6 represents a C1~4 alkyl group or a C6~12 aryl, X 2 represents a hydrogen atom or a group represented by the formula (2), s represents the number of 2~6, L 2 Represents a C1-6 alkylene group or a C6-12 arylene group, and at least one of s pieces of X 2 is a group represented by formula (2). |