| abstract |
An embodiment includes a package body having a cavity, first to fourth leadframes disposed in the package body, a first semiconductor layer, an active layer, and a second semiconductor layer, Wherein each of the first to fourth lead frames has a top surface exposed to the cavity and a side portion bent from one side of the top surface and exposed to one surface of the package body, Wherein the first light emitting chip is disposed on the upper surface portion of the first lead frame, and the second light emitting chip is disposed on the upper surface portion of the third lead frame. |