| abstract |
Systems and methods are provided for preventing cracks in a passivation layer. In an embodiment, the contact pad has a first diameter, the opening through the passivation layer has a second diameter, and the first diameter is larger than the second diameter by a first interval of about 10 μm. In another embodiment, the under bump metallization is formed through the opening and the under bump metallization has a third diameter that is greater than the first diameter by a second interval of about 5 μm. In yet another embodiment, the sum of the first and second intervals is greater than about 15 μm. |