patent/KR-20130131699-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130131699-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05567 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13183 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13084 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13176 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13173 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13169 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13164 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13076 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11849 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0347 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-119 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05557 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13139 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13178 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate	2012-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d32fa73c477f48c7e105a7215fd691f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51169fcc807c034f397f908ac59cc9c5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a6e74ffe6f8f954b335d9f18c88e7389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1d8bfd18d72ac71e61642df42710672
publicationDate	2013-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20130131699-A
titleOfInvention	Electrical connection structure and manufacturing method
abstract	The present invention relates to an electrical connection structure and a method of manufacturing the same, a substrate having a bonding pad, a protective film disposed on the substrate to open the bonding pad, a solder ball electrically connected to the bonding pad, disposed on the bonding pad To form a solder ball support film for providing an inner region in which the solder ball is filled, and a metal film including a metal disposed between the bonding pad and the solder ball support film and having a smaller ionization tendency than the metal constituting the bonding pad. It may include.
priorityDate	2012-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7112522-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20080079742-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011024900-A1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID78938 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID410060652 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57376528 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID451181287

Total number of triples: 67.