http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130129844-A

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filingDate 2013-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b13036a1dd362416d009e0aa1304e063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25da13a7c88ec47bef60a5700d99b88b
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publicationDate 2013-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20130129844-A
titleOfInvention Surface treatment film, surface protection film and precision electrical and electronic components to which it is bonded
abstract The present invention is a surface protection film capable of preventing the oligomer from depositing on the surface from the inside of the base film even when used for heat treatment at a high temperature, and preventing the oligomer from contaminating the surrounding working environment or the product, and the bonding thereof. Provides precision electrical and electronic components. As for the surface protection film 10, the adhesive layer 2 is laminated | stacked on one surface of the base film 1 which has flexibility, and the peeling film 4 which peeled off on the surface of the said adhesive layer 2 peels It is possible to prevent deposition of oligomers resulting from the base film 1 even after being laminated through the treated surface 4a and subjected to a heat treatment for at least the other surface of the base film 1 at a temperature of 160 ° C. for 60 minutes. The protective layer 3 which can be formed is formed. The protective layer 3 consists of a thin film of the resin composition containing an epoxy resin, the polyester resin which has a functional group which reacts with an epoxy group, and an amine-type hardening | curing agent.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160060595-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150113834-A
priorityDate 2012-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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