| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c1755eede76ea7e719a3e0d2843cd793 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1163 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-687
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2013-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dad8bae74be06b33bc72bba5eb59da65
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7359dcd6db0ac1ce4b9c3784bab5a42b |
| publicationDate |
2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130126685-A |
| titleOfInvention |
Conductive material and connection structure |
| abstract |
This invention provides the electrically-conductive material which can make the connection resistance of the obtained connection structure low, when the connection structure is obtained by electrically connecting between electrodes. The electrically-conductive material which concerns on this invention contains binder resin and electroconductive particle which has solder on the electroconductive surface. The said binder resin contains the curable compound which can be hardened by heating, and a thermosetting agent. When the said solder in the said binder resin and the said electroconductive particle were heated at the temperature increase rate of 10 degree-C / min, respectively, and differential scanning calorimetry was measured, the exothermic peak top P1t temperature in this hardening of the said binder resin is said It is lower than the endothermic peak top P2t temperature in the melting of the solder. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160130738-A |
| priorityDate |
2012-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |