| abstract |
Semiconductive shields that can be peeled off are in weight percent based on the weight of the composition. (A) 20 to 80% of an olefin and an α, β-unsaturated carbonyl comonomer interpolymer, (B) 1 to 90% chlorinated polyolefin, (C) 20 to 45% carbon black, (D) 0.1 To 5% antioxidant, (E) 0.01 to 5% acid scavenger stabilizer, (F) optionally, free radical initiator, (G) optionally, silane functional group, (H) optionally, sulfur-containing curing agent, and (I) optionally comprises a composition comprising a radiation-curing catalyst. |