http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130121721-A

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filingDate 2013-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b8a67ad410453d6db3bb7a3e392cd82
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publicationDate 2013-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20130121721-A
titleOfInvention Slurry, polishing liquid set, polishing liquid, gas polishing method and gas
abstract The polishing liquid according to the present embodiment contains an oxidizing agent, an additive (except for the above oxidizing agent), abrasive grains, and water, and the abrasive grains comprise a hydroxide of a tetravalent metal element, and the following (a) and (b) At least one of the following conditions is satisfied. (a) The abrasive provides 1.00 or more of absorbance with respect to the light of wavelength 400nm in the aqueous dispersion which adjusted the content of the abrasive grain to 1.0 mass%. (b) The abrasive provides 1.000 or more of absorbance with respect to the light of wavelength 290nm in the aqueous dispersion which adjusted the content of the abrasive grain to 0.0065 mass%.
priorityDate 2012-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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