| abstract |
While preventing a dicing film from yielding and breaking, it provides the dicing die-bonding film which can break | disconnect a die bond film suitably by tensile tension. In the dicing die-bonding film of this invention, the tensile strength in 25 degreeC in the contact part which the outer periphery of the pushing jig of a dicing film contacts is 15N or more and 80N or less, and the yield point elongation is 80% or more, Tensile strength at 25 degrees C in the wafer adhesion part of a single film is 10N or more, 70N or less, and yield point elongation is 30% or more, and [(Tension strength of a contact part)-(Tension strength of a wafer attachment part) is 0N or more. It is 60 N or less, and the elongation at break at 25 degrees C of a die-bonding film is larger than 40%, and is 500% or less. |