http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130113604-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_008618203a3bbb326839f0d31d0bec52 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06755 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06733 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2884 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2896 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2863 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate | 2012-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_055de7fe9638a1dafde6d790fe2f241c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_53dd9c82bd0b7936077f1d16b19a45d8 |
| publicationDate | 2013-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20130113604-A |
| titleOfInvention | Method for manufacturing contact structure for semiconductor package inspection, Contact structure for semiconductor package inspection and socket for semiconductor package inspection comprising same |
| abstract | A method of manufacturing a contact structure for inspecting a semiconductor package is disclosed, wherein the method of manufacturing a contact structure for inspecting a semiconductor package includes (a) forming a tip portion of a contactor for contacting a contact ball of a semiconductor package on a substrate, (b A) an insulating material having at least one hole formed on the tip portion joins the connecting plate or a connecting plate of the insulating material on the tip portion, and then forming at least one hole; and (c) forming the at least one hole in the hole. Forming a body of the substrate and (d) removing the substrate. In addition, a socket for inspecting a semiconductor package is disclosed, wherein the socket for inspecting a semiconductor package is fixed to each through hole and a connection plate of an insulating material having a plurality of through holes penetrated up and down, and contacting a contact ball at a lower end thereof. And a contact structure for inspecting a semiconductor package including a protruding tip portion and a top portion protruding body portion so as to be energized with a printed circuit board, and a tension portion having a conductive end portion and a cushioning member, and connected to an upper portion of the tension portion. It may further include a printed circuit board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180130418-A |
| priorityDate | 2012-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.