| abstract |
As a mask sheet, even if the tape is formed at L / F at a lower temperature than the thermoplastic mask sheet and exposed to a high temperature, thermal deterioration such as the occurrence of adhesive residue at the time of peeling of the mask sheet does not occur, has flatness, little deformation, and conventional adhesion at high temperature. There is a demand for a mask sheet that is harder than the mask sheet, has excellent W / B properties, has less molding resin leakage at the time of sealing than the adhesive mask sheet, has excellent light peelability even after the plasma cleaning process, and has less adhesive residue. A thermosetting adhesive layer is laminated on one side of a base material layer, and this invention is a mask sheet for semiconductor device manufacture peelable on a metal plate, The said thermosetting adhesive layer contains the siloxane skeleton whose glass transition temperature is 45-170 degreeC. The mask sheet for semiconductor device manufacture containing a polyimide resin, an epoxy resin, a hardening | curing agent, and a fluorine additive is provided. |