| abstract |
The present invention provides a film-like sealant useful for tightly sealing an electronic device at low temperature, and a sealing method using the sealant. At least a part of the device is covered with a film-like sealant containing a copolymerized polyamide-based resin, the sealant is heated to melt and cooled, and the device is covered and sealed. The melting point or softening point of the copolymerized polyamide-based resin is 75 to 160 ° C and may have crystallinity. Copolyamide-based resin may comprise units derived from a multi may be a copolymer, C 8 -16 components having long-chain alkylene group (C 9 -17 lactam and amino-C 9 -17 alkanoic acid, etc.) . The film sealant may coat one side of the device. |