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filingDate 2013-03-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f317110a1c4e0ac835fcf72d5f74bce6
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publicationDate 2013-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20130108181-A
titleOfInvention Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
abstract Thereby suppressing the generation of foreign matter in the processing container. Comprising the steps of: transporting a substrate into a processing vessel; supplying a source gas containing a predetermined element and a halogen element to a processing vessel containing the substrate to form a thin film on the substrate; A step of supplying an oxygen-containing gas and a hydrogen-containing gas into a heated processing vessel under a pressure lower than atmospheric pressure in a state where the substrate is subjected to a first reforming treatment with respect to the by- Containing gas and a hydrogen-containing gas are supplied into a heated processing vessel under a pressure lower than atmospheric pressure in a state in which the substrate is not present in the processing vessel, And subjecting the product to a second reforming treatment.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180120593-A
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