http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130107320-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c6a9fd6219b32cd3893a49979951bf4 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 |
| filingDate | 2011-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8fe063499fca366bb333322e4ea9e227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a0cf4f8fd89a6f485c52c30e054f1bd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f185d3570ddac15283cbb17907fc8965 |
| publicationDate | 2013-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20130107320-A |
| titleOfInvention | Low temperature sinterable conductive paste and method for forming conductive film and conductive film using same |
| abstract | In the case where a substrate having low heat resistance is to be used, heat treatment at around 120 ° C. where deformation does not occur is desired. In addition, if the resistance can be reduced regardless of the type of the resin to be used for the conductive paste, not only the paste can be designed according to the purpose, but also the field of application is expanded. Accordingly, the present invention provides a conductive paste capable of forming a conductive film that exhibits high conductivity even at a low temperature of about 120 ° C, regardless of whether the type of resin to be constituted is thermosetting or thermoplastic. As a method for forming a conductive film, a conductive paste in which dicarboxylic acid having 2 to 8 carbon atoms is added to a paste composed of silver nanoparticles, a dispersion medium and a resin coated with an organic substance having 2 to 6 carbon atoms is used as the wiring forming paste. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210112877-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160087858-A |
| priorityDate | 2010-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 116.