Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2891 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1189 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-314 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31909 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
filingDate |
2009-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f67a322600fdcd0fcf9e0472d92b6bf8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b818f1f7026e109799f1f59df94173d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81f20d33bd59ea5c9d50bfab0d59b7c7 |
publicationDate |
2013-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20130106451-A |
titleOfInvention |
Anisotropic conductive film |
abstract |
The present invention uses an anisotropic conductive film that uses a polymerizable acrylic compound that can be cured at a relatively low temperature and shorter time than a thermosetting epoxy resin together with a film-forming resin, and a crimping condition of a compression temperature of 130 ° C. and a compression time of 3 seconds. When anisotropic connection is performed, high adhesive strength and good conduction reliability can be realized. The anisotropic conductive film for this has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two organic peroxides having different half-life temperatures for one minute. Of these two organic peroxides, the organic peroxide having a high half-life temperature for one minute generates benzoic acid or a derivative thereof by decomposition. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160115909-A |
priorityDate |
2008-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |