| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d648658dd620f548c24de39659a5e9e3 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D9-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-263
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D4-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate |
2011-09-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3a9ef91bf91305af9d95f427556b7191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_103623980b4e2c0876402fe20122b680
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c045f34b646ddf0136aa91147ce6a99
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cc6c9bdbb833e50fc108a4e0d0c2f9e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e07780963d8cef07e5e8c08b9d4c227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_377cf945e1396405842319162e8fe5cb |
| publicationDate |
2013-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130102600-A |
| titleOfInvention |
Polymer or monomer compositions comprising one or more mono-amides and / or one or more diamides for removing material from the substrate and methods of using the same |
| abstract |
Provided are compositions and methods useful for removing organic materials from substrates, such as electronic device substrates such as microelectronic wafers or flat panel displays. A method of applying a minimum volume of composition as a coating to an inorganic substrate, wherein sufficient heat is applied and immediately rinsed with water to provide complete removal. The compositions and methods may be suitable for removing and fully dissolving various positive and negative photoresists as well as thermosetting polymers from electronic devices. |
| priorityDate |
2010-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |