abstract |
The positive photosensitive resin composition of the present invention contains an alkali-soluble resin having a phenolic hydroxyl group, a compound capable of generating an acid by light, a heat crosslinking agent, and an acrylic resin. According to the positive photosensitive resin composition of the present invention, it is possible to provide a positive photosensitive resin composition capable of forming a resist pattern which can be developed with an aqueous alkali solution and is excellent in adhesion and thermal shock resistance at sufficiently high sensitivity and resolution. |