http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130078210-A

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242
filingDate 2011-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7fb1b2d142a6fb366f015ce69ac424a8
publicationDate 2013-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20130078210-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract According to the present invention, after forming the buried gate region, the nitride layer spacer is formed on the sidewall of the buried gate region, but the spacer of the active region is etched to leave the spacer in the device isolation region. Provided are a semiconductor device and a method of manufacturing the same, in which shorts do not occur.
priorityDate 2011-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
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Total number of triples: 21.