Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6b822ee046eb6c45d1e3bd9ce9c1782e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-1213 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-1368 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F2203-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-134309 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-13394 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-133345 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-51 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7869 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14616 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78696 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-42384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66742 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66969 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4908 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78606 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B44-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336 |
filingDate |
2011-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a573ef6c456478ce2ffc150bbcce9f7d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2fe75a0d2e464a33d9fd0623d9f0e7b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac11ee1c1f0f829494971d06f1517a7a |
publicationDate |
2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20130070641-A |
titleOfInvention |
Semiconductor device and manufacturing method thereof |
abstract |
One object of the present invention is to provide a semiconductor device including an oxide semiconductor that includes stable electrical properties and high reliability. Another object is to manufacture highly reliable semiconductor devices with high yields. In a staggered transistor having a top gate structure including an oxide semiconductor film, as a first gate insulating film in contact with the oxide semiconductor film, a silicon oxide film is formed by using a film forming gas containing silicon fluoride and oxygen by plasma CVD. As the second gate insulating film laminated on the first gate insulating film, a silicon oxide film is formed by using a film forming gas containing silicon hydride and oxygen by plasma CVD. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9722056-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150098699-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9478664-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9698274-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10050132-B2 |
priorityDate |
2010-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |