| abstract |
(assignment) A negative type photoresist used for forming a pattern on a substrate such as a silicon substrate, a glass substrate, a metal film substrate, and a metal oxide film substrate can be quickly and accurately peeled off at low temperatures even after heat treatment, Provide the peeling method used. (Solution) (A) 70 to 95% by mass of a hydrocarbon solvent containing three or more kinds of naphthalene substituted with an alkyl group and having a total content of 50% by mass or more thereof, and (b) an alkyl group And 5 to 30% by mass of benzene sulfonic acid having a total of at least 8 carbon atoms. |