| abstract |
Even if it is a thick film, it provides the resin composition which provides the photocurable resin hardened | cured material which is favorable in a crack resistance and can maintain low linear expansion coefficient, low thermogravimetry reduction, and low shrinkage rate. The photosensitive silicone resin composition which concerns on this invention is a photosensitive silicone resin composition containing a silica particle containing condensation reactant (A) and a photoinitiator (B), and this silica particle containing condensation reactant (A) is following General formula (1) : Polysiloxane compound (a) comprising a hydrolysis condensation product of at least one silane compound represented by R 1 n1 SiX 1 4-n1 (wherein R 1 , n1, X 1 is defined in the claims) and / or the the condensation reaction of the silane compound, and the silica particles (b), terminal structure Si-OY (wherein, Y is defined in the claims), the following equation (2): 0 <[Si -O-SiR 3 3] / ( [Si-OR 2 ] + [Si-O-SiR 3 3 ]) ≤ 1 {wherein R 2 and R 3 are defined in the claims.} And are characterized by having a photopolymerizable functional group. |