Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31938 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73104 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D133-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J165-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
2012-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d558f51235128c0066525fc05b80de3d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_334f81717612b72a029585c5e5a9896e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf45fbf2f608c17700db1e7c0fc15f4c |
publicationDate |
2013-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20130059291-A |
titleOfInvention |
Manufacturing method of underfill material and semiconductor device |
abstract |
An object of the present invention is to provide an underfill material capable of manufacturing a semiconductor device having high connection reliability and a method of manufacturing a semiconductor device using the same, while ensuring a usable material by alleviating the difference in thermal response behavior between the semiconductor element and the adherend. do. In the underfill material of this invention, storage elastic modulus (E ') [MPa] and thermal expansion coefficient (alpha) [ppm / K] after heat-hardening at 175 degreeC for 1 hour satisfy | fills following formula (1) at 25 degreeC. E 'x alpha <250000 [Pa / K]... (One) |
priorityDate |
2011-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |