| abstract |
The present invention relates to an electroless palladium plating solution, and more particularly, to an electroless palladium plating solution that can improve the connection reliability by increasing the adhesion between the underlying metal and palladium. According to the present invention, the problems resulting from the instability of the conventional self-catalyzed electroless palladium plating solution can be overcome, and in particular, it is possible to eliminate the crude precipitation or the abnormal precipitation to the non-conductive portion. Further, even one plating of gold on the base metal improves the adhesion between the base metal and palladium, and as a result, the connection reliability of the solder or wire bonding is improved. |