| abstract |
A first electronic component 1 having a first terminal having a solder layer on its surface, and a second electronic component 2 having a second terminal joined to the first terminal of the first electronic component 1 are provided. The manufacturing method of an electronic device arrange | positions the 1st terminal of the some 1st electronic component 1, and the 2nd terminal of the some 2nd electronic component 2, respectively, and between each 1st terminal and each 2nd terminal. A plurality of laminates are formed by arranging the resin layer 3 in the plurality, and the plurality of laminates are pinched from the lamination direction of the laminate at the same time while the plurality of laminates are heated. |