| abstract |
The present invention is not only halogen-free, but in order to be highly sensitive and excellent in solder heat resistance, electroless gold plating resistance, moisture resistance, and electrode corrosion resistance, the curable resin composition includes (A) a structure represented by the following general formula (1): Curable resin derived from a compound, and (B) layered double hydroxide are contained. The said curable resin composition or its dry film can be advantageously applied to formation of the cured film, such as the soldering resist of a printed wiring board and a flexible printed wiring board, and a prepreg. (Wherein R 1 represents a (m + l) valent polyhydric alcohol derivative, m and n are an integer of 1 or more and less than 10, l is an integer of 0 or 1 or more, and R 2 is CH 2 , C 2 H 4 , C 3 H 6 , C 4 H 8 , a substituted or unsubstituted aromatic ring, and R 3 represents a substituted or unsubstituted aromatic ring.) |