http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130045187-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2021-6015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-314 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2021-60277 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 |
| filingDate | 2012-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f870b2e96757d40c12be160dcc127a1 |
| publicationDate | 2013-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20130045187-A |
| titleOfInvention | Thermally Conductive Adhesive Composition, Adhesive Sheet Using the Same, and Thermally Conductive Dicing Die Attach Film |
| abstract | Provided are a thermally conductive adhesive composition having excellent heat dissipation characteristics at high thermal conductivity, good adhesion, and excellent reliability after a moisture resistance test, an adhesive sheet and a thermally conductive dicing die attach film using the same. (A) a polymer having an epoxy resin and a reactive functional group in the polymer backbone, (B) an epoxy resin having at least two epoxy groups in one molecule, and (C) a thermally conductive adhesive composition comprising an inorganic filler having a thermal conductivity of 10 W / mK or more subjected to surface treatment with a silicone compound having a number average molecular weight of 500 to 10000 represented by a specific average composition formula; An adhesive sheet comprising a substrate and an adhesive layer comprising the composition provided on the substrate; A thermally conductive dicing die attach film provided with a dicing film which has a base material and the adhesive layer provided on it, and the adhesive bond layer containing the said composition provided on the adhesive layer of the said dicing film. |
| priorityDate | 2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 139.