| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c3bf98aa6d4de2752f2f6fac638dc2cd |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-304 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D175-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2011-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b23b49d2b44af962bd40b50d28de360b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_234792aed488a3184cd233c4cd94bb06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0b7cb3c84b68632bb83a932255d1797 |
| publicationDate |
2013-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130037841-A |
| titleOfInvention |
Adhesive composition for flexible circuit board, Adhesive sheet using same and method for manufacturing same |
| abstract |
Polyurethane urea resin (A) whose acid value is 5-50 mgKOH / g obtained by reaction of the urethane type prepolymer which has an isocyanate terminal group, and an amine compound; Epoxy curing agent (B); And phenol curing agents (C); Provided is an adhesive composition for a flexible circuit board containing a thermoplastic resin (D); as a solid and an adhesive sheet using the same. The adhesive composition of the present invention is given an initial adhesive strength of 15gf or more to ensure excellent workability, and also has a long-term storage property of 3 months or more, the soldering heat resistance of 280 ℃ or more, which is a level corresponding to the lead-free solder reflow process temperature Meets. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220100163-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190004489-A |
| priorityDate |
2011-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |