| abstract |
The integrated circuit 100 includes a first die 105, 110, a second die 115, wherein the first die may be disposed on a second die, and a plurality of coupling the first die to the second die. Die-to-die connections 205, 205A, and 205B, and a plurality of probe pads 120, 120A, 120B, 120C, 120D, and 120E, each probe pad coupled to at least one die-to-die connection (305, 310). , 405, 410. The first die may be configured to establish internal connections 315, 415, 420, 515 that couple the first probe pad to the second probe pad. In some embodiments, each probe pad is coupled to the micro bumps 210 and the internal connection couples the micro bumps to each other. Some embodiments utilize through silicon vias extending through the second die. Also disclosed is a method of testing the integrated circuit. |