| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a52af89e67b7b044f04d055c573de211 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
2013-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_debab755bbe7671f2fbe7142d1934cbe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93df7c9dd63abd59358b34d22a574a0b |
| publicationDate |
2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130029794-A |
| titleOfInvention |
Printed wiring board which has a soldering resist layer which consists of a photosensitive resin composition, its hardened | cured material, and its hardened | cured material |
| abstract |
This invention provides the photosensitive resin composition which can form the soldering resist layer which has high coloring power, is excellent in concealability, and has a high aspect ratio resolution. The present invention relates to a photosensitive resin composition comprising a perylene-based colorant and a carboxylic acid-containing resin. |
| priorityDate |
2008-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |