http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130027436-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_07df74462e6193cbf71c250f0d4590e7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-321 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-14 |
| filingDate | 2012-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81f20d33bd59ea5c9d50bfab0d59b7c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09f5bfb6f387f0ac0f0703705a565b97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a84c7977a35de537b817a5621e8589a2 |
| publicationDate | 2013-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20130027436-A |
| titleOfInvention | Method for manufacturing anisotropic conductive film and connection structure |
| abstract | An object of the present invention is to provide an anisotropic conductive film which achieves good connection reliability and repairability when anisotropic conductive connection is made between the terminals of the board and the terminals of the electronic component. In the present invention, an anisotropic conductive film obtained by forming a resin composition containing a film-forming resin, a liquid curable compound, conductive particles, an elastomer and a curing agent into a film has a dynamic viscoelasticity measurement in tensile vibration mode according to JIS K7244-4 after its curing (25 DEG C) is 0.5 to 1.5 GPa. The elastomer exhibits a breaking strength of 50 to 80 MPa and a breaking elongation of 10% or less according to ASTM D638. The content of the elastomer in the resin composition is 20 to 50 mass% in the total mass of the film forming resin, the liquid curable compound, the conductive particles, the elastomer and the curing agent. The conductive particles used exhibit a compression hardness of 300 to 500 kgf / mm 2 at 10% displacement under the conditions of a load of 49.035 mN and a load speed of 2.226 mN / sec. |
| priorityDate | 2011-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.