| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6f932d94618d9b875e401457b33e9761 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136295 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02F1-136286
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-026 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02F1-1368
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00 |
| filingDate |
2012-07-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51864babcc644b14518a06f11c6734ba
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9094351ab429c10ea501e9d7e0fae0cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55178493c933ad4b56ac2ed8a215425d |
| publicationDate |
2013-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20130021320-A |
| titleOfInvention |
Method of forming metal wiring |
| abstract |
The present invention relates to a method for forming a wiring of a copper-based metal film using an etching composition which etches only an upper copper film while minimizing attack on a lower metal oxide film, And an etchant composition of the copper-based metal film. |
| priorityDate |
2011-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |