| abstract |
It is to provide a wiring board on which a metal film is hard to peel off. The process (X) in which the agent containing the following compound ((alpha)) is provided in the base surface, and the process (Y) in which the metal film is provided in the surface of the said compound ((alpha)) by the method of wet plating are provided. The compound (α) is a compound having an OH group or an OH generating group, an azido group, and a triazine ring in one molecule, and the gas is composed of a polymer. |