| abstract |
The present invention provides a dilute alkali developing photocurable thermosetting resin composition suitable for obtaining a cured coating having excellent adhesion to a substrate, chemical resistance, solder heat resistance, PCT resistance, cold shock resistance, electroless gold plating resistance, electrical insulation, and the like. do. The photocurable thermosetting resin composition of this invention contains carboxyl group-containing resin, photosensitive resin which has a structure represented by following General formula (1)-(3), and a photoinitiator, It is characterized by the above-mentioned. (1), R 1 represents a group of the following formula (2), R 2 represents a methyl group or OR 1 group, n + m = 1.5 to 6.0, n = 0 to 6.0, m = = 0 to 3, n: m = 100: 0 to 0: 100) (In the formula (2), R 3 represents hydrogen or a methyl group, R 4 represents a group of the following formula (3) or hydrogen, and k = 0.3 to 10.0) (In the formula (3), R 5 represents hydrogen or a methyl group) |