| abstract |
Improved compositions and methods for removing photoresist, polymer, residues after etching, residues after oxygen ashing from interconnects, wafer-level packaging and printed circuit boards are disclosed. The process includes contacting the substrate with a mixture containing an effective amount of an organic ammonium compound, about 2 to about 20 weight percent oxoammonium compound, optionally an organic solvent and water. <Index> Wafer-level packaging, printed circuit boards, photoresist strippers, organic ammonium compounds, oxoammonium compounds |