Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_526c4732e03c7646d5fb43961e4584a7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-703 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-70 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-38 |
filingDate |
2011-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_793c9cf30edfd8a5677056b41af9b8c5 |
publicationDate |
2013-02-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20130012631-A |
titleOfInvention |
Cutting material for LED materials and cutting method for LED materials |
abstract |
The present invention relates to a cutting device for LED materials and a cutting method of LED materials, and more specifically, to improve the cutting speed of the LED material, and at the same time cutting device for LED materials such that no burrs are formed in the cut unit LED unit and It is related with the cutting method of LED material. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105728956-A |
priorityDate |
2011-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |