| abstract |
The etching solution of the metal film containing copper may contain 50% to 70% by weight of phosphoric acid, 1% to 5% by weight of nitric acid, 10% to 20% by weight of acetic acid, and 0% to 2% by weight of an azole compound. Contains preservatives and excess water. Therefore, by etching the metal film containing copper having different thicknesses using the same etching solution, it is possible to reduce the manufacturing cost. |