abstract |
The present invention is an epoxy resin composition mainly composed of an epoxy resin, a curing agent, and an inorganic filler, wherein the epoxy resin includes a crystalline epoxy resin and a rubber additive for dispersing the inorganic filler in the epoxy resin. In addition, it is possible to provide a high heat-radiating substrate by using the epoxy resin in a printed circuit board as an insulating material. |